发明名称 METHOD FOR FORMING DIELECTRIC FILM
摘要 <p>A method for forming an insulating film comprising the steps of forming an insulating film on a substrate and exposing the insulating film to oxygen radical O* or hydrogen nitride radical NH* in a plasma of Kr or Ar contained as an inert gas so as to transform the quality of film.</p>
申请公布号 WO2001069665(P1) 申请公布日期 2001.09.20
申请号 JP2001001966 申请日期 2001.03.13
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