LSi package and internal connecting method used therefor

摘要

The present invention is provides an LSI package without employing steps for forming solder bumps on a bare chip and soldering to an interposer. In the present invention, a bare chip is mounted on the LSI package by forming wiring patterns which connect to bare chip I/O terminals in a build-up layer of a substrate. Furthermore, the wiring patterns are formed so as to connect outer I/O terminals on the substrate.