METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE, AND CONDUCTOR PASTE

摘要

A method of manufacturing a multilayer ceramic substrate sintered at low temperature includes the steps of forming a wiring layer by printing a green sheet (1) with conductor paste (4), bonding green sheets (6) with a wiring layer in one or both sides to form a laminate, and sintering the laminate. In the sintering step, the adhesive layers (8) used for bonding or the binder resin in the green sheets are first burned, followed by sintering the glass ceramic in the green sheets. Simultaneously with or after the beginning of the sintering of glass ceramic, the conductor particles in the conductor paste begins sintering. The method provides a wiring substrate with high accuracy without pattern deformation, and a low-temperature sintered multilayer ceramic wiring substrate, which has electrodes of a dense film structure without causing cracks in the glass ceramic part around the electrodes.