发明名称 |
Substrate for power semiconductor modules with through-plating of solder and method for its production |
摘要 |
A substrate for power semiconductor modules with a through-plating of solder, includes two metal plates and a ceramic plate which is seated as a layer between the metal plates and has a through hole formed therein. The substrate is plated through by making a through hole in one of the metal plates in alignment with the through hole in the ceramic plate and applying a paste solder to one side of the substrate. The substrate is then subjected to a furnace step, so that the paste solder flows into the through holes and the solder makes a permanent contact between the two metal plates. A method for producing the substrate is also provided.
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申请公布号 |
US2001022236(A1) |
申请公布日期 |
2001.09.20 |
申请号 |
US20010789341 |
申请日期 |
2001.02.20 |
申请人 |
STOLZE THILO;LODDENKOETTER MANFRED |
发明人 |
STOLZE THILO;LODDENKOETTER MANFRED |
分类号 |
B23K1/00;B23K1/008;B23K101/42;H01L21/48;H01L23/12;H01L23/373;H05K1/03;H05K1/11;H05K3/20;H05K3/34;H05K3/40;(IPC1-7):H05K3/00;H05K3/36;H05K3/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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