发明名称 REDUCING POLYMERIZATION STRESS BY CONTROLLED SEGMENTAL CURING
摘要 A photopolymerizable material is exposed to light to effect curing. A portio n of the material is exposed to light in a conventional manner, while at least one other portion of the material is masked from direct exposure to the ligh t by use of a mask (10) having at least one mask segment (11) which either completely or at least partially blocks the light. In this manner, the polymerization stress associated with the cured materials is limited or minimized due to extended molecular relaxation promoted by this controlled o r hybrid curing technique. Also according to the invention, different segments (30, 31) of a material to be cured (22) are exposed to different wavelengths of light energy (21) or one such segment (30, 31) is exposed to light energy while another such segment is not.
申请公布号 CA2403154(A1) 申请公布日期 2001.09.20
申请号 CA20012403154 申请日期 2001.03.15
申请人 DENTSPLY INTERNATIONAL INC. 发明人 JIN, XIAOMING;HAMMESFAHR, PAUL D.
分类号 A61C13/15;A61C19/00;A61K6/00;B29C35/08;G02B6/04;G02B6/42;(IPC1-7):A61C19/00 主分类号 A61C13/15
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