| 摘要 |
<p>A low-modulus-of-elasticity flexible adhesive interposer substrate (10) has high aspect ratio via conductors (22, 24) to which an electronic device, such as a semiconductor chip or die (102) or other component, is attached, e.g., for a high density electronic package. A mehtod for making the flexible adhesive interposer substrate (10) includes etching a sheet of metal (20) to form the high aspect ratio via conductors (22, 24) which are held in position by a sheet or layer of a molecularly flexible adhesive (40). The via conductors (22, 24) may be built up to even greater aspect ratio. Such flexible interposer (10) may include high aspect ratio via conductors (22, 24) for a plurality of similar or different electronic devices.</p> |
