发明名称 Touch sensing apparatus and mehtod
摘要 An apparatus and method for sensing touch between a compression mold and a workpiece located in the compression mold including a mold cavity and a mold closure movable relative to the workpiece. The apparatus may include at least one touch sensor pad positionable to signal touch between the mold closure and the workpiece. The touch sensor pad may be in communication with a touch sensor monitor for indicating touch between the workpiece and the mold closure. The touch sensor pad may also be embodied in a touch sensor assembly.
申请公布号 US2001022406(A1) 申请公布日期 2001.09.20
申请号 US20010850638 申请日期 2001.05.07
申请人 WOODMANSEE DONALD ERNEST;UPADHYAY RAM KUMAR 发明人 WOODMANSEE DONALD ERNEST;UPADHYAY RAM KUMAR
分类号 B21D37/00;B29C43/58;G01L1/14;G01L1/16;G01L1/22;G01L1/24;G01L5/00;(IPC1-7):B29C43/58 主分类号 B21D37/00
代理机构 代理人
主权项
地址