| 摘要 |
An object of the present invention is to provide a solid-state image pickup apparatus capable of reducing man-hours for bonding, improving bonding quality, and being readily integrated into peripheral devices, and a manufacturing method thereof. The solid-state image pickup apparatus of the present invention includes a transparent substrate having a projecting electrode connection electrode terminal, and a solid-state image pickup device in which each first projecting electrode corresponding to the projecting electrode connection electrode terminal is formed on each electric signal I/O terminal, the transparent substrate and the solid-state image pickup device being bonded by face-down packaging. The projecting electrode connection electrode terminal and each first projecting electrode are connected by ultrasonic bonding. On electrode terminals of the transparent substrate are respectively formed second projecting electrodes. On the transparent substrate, a print board having a frame aperture being as large as the solid-state image pickup device and a non-pin type lead terminal structure is joined by electrically connecting second projecting electrodes and by hermetically sealing a light receiving surface of the solid-state image pickup device with a thermosetting resin.
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