发明名称 Process for galvanically treating workpieces used e.g. in the production of circuit boards comprises contacting the workpieces with a palladium colloidal solution, and recovering the solution after use
摘要 Process for galvanically treating workpieces comprises contacting the workpieces with a palladium colloidal solution; and recovering the solution after use, in which the palladium colloidal particles are removed from the solution using a membrane filter. Preferred Features: The membrane filter has a pore size of 200-10000, preferably at least 500, especially at least 2000 Daltons. The colloidal solution adhered to the surfaces of the workpieces are removed using a rinsing fluid, which is introduced under pressure through the membrane filter. Before removing the colloidal particles, the solution is mixed with a hydrochloric acid solution.
申请公布号 DE10024239(C1) 申请公布日期 2001.09.20
申请号 DE20001024239 申请日期 2000.05.15
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 MIDDEKE, HERMANN;BRANDES, MARIOLA;DYRBUSCH, BRIGITTE
分类号 B01D61/02;B01D61/14;B01D71/68;C22B7/00;C22B11/00;C23C18/16;C25D21/16;C25D21/20;(IPC1-7):C23C18/00;B01D61/00;C25D3/50 主分类号 B01D61/02
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