发明名称 |
Process for galvanically treating workpieces used e.g. in the production of circuit boards comprises contacting the workpieces with a palladium colloidal solution, and recovering the solution after use |
摘要 |
Process for galvanically treating workpieces comprises contacting the workpieces with a palladium colloidal solution; and recovering the solution after use, in which the palladium colloidal particles are removed from the solution using a membrane filter. Preferred Features: The membrane filter has a pore size of 200-10000, preferably at least 500, especially at least 2000 Daltons. The colloidal solution adhered to the surfaces of the workpieces are removed using a rinsing fluid, which is introduced under pressure through the membrane filter. Before removing the colloidal particles, the solution is mixed with a hydrochloric acid solution.
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申请公布号 |
DE10024239(C1) |
申请公布日期 |
2001.09.20 |
申请号 |
DE20001024239 |
申请日期 |
2000.05.15 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
MIDDEKE, HERMANN;BRANDES, MARIOLA;DYRBUSCH, BRIGITTE |
分类号 |
B01D61/02;B01D61/14;B01D71/68;C22B7/00;C22B11/00;C23C18/16;C25D21/16;C25D21/20;(IPC1-7):C23C18/00;B01D61/00;C25D3/50 |
主分类号 |
B01D61/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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