发明名称 |
Apparatus for mounting semiconductor chips on a substrate |
摘要 |
<p>The device displaces the substrate (1) in steps in a first direction (x) to a bonding station to make the next substrate position (2) available. A sensor (12) is provided for determining the position of a longitudinal edge (4) of the substrate relative to a second direction (y) orthogonal to the first direction. The sensor consists of measurement and reference light barriers.</p> |
申请公布号 |
EP1134788(A1) |
申请公布日期 |
2001.09.19 |
申请号 |
EP20000810229 |
申请日期 |
2000.03.17 |
申请人 |
ESEC TRADING SA |
发明人 |
MANNHART, EUGEN, DR.;ENZLER, AUGUST;ODERMATT, ANDRE |
分类号 |
H01L21/52;H01L21/00;H01L21/68;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|