发明名称 Sputtering method for forming dielectric films
摘要 A method for forming a dielectric film having a desired composition comprising sputtering a dielectric material onto a substrate to produce an intermediary film, the intermediary film incorporating one or more elements in addition to those elements included in the desired composition of the dielectric film; and removing the one or more additional elements from the intermediary film to produce the dielectric film having the desired composition.
申请公布号 US6290822(B1) 申请公布日期 2001.09.18
申请号 US19990472332 申请日期 1999.12.23
申请人 AGERE SYSTEMS GUARDIAN CORP. 发明人 FLEMING ROBERT MCIENORE;STEIGERWALD MICHAEL LOUIS;WONG YIU-HUEN;ZAHURAK SUSAN M.
分类号 C23C14/08;C23C14/58;H01L21/28;H01L21/314;H01L21/316;H01L21/768;H01L23/522;H01L23/532;H01L29/51;(IPC1-7):C23C14/34 主分类号 C23C14/08
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