发明名称 |
Carriers including projected contact structures for engaging bumped semiconductor devices |
摘要 |
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.
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申请公布号 |
US6291897(B1) |
申请公布日期 |
2001.09.18 |
申请号 |
US19990305493 |
申请日期 |
1999.05.05 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
WARK JAMES M.;AKRAM SALMAN |
分类号 |
H01L21/60;H01L23/485;H01L23/498;H05K3/32;H05K3/40;(IPC1-7):H05K3/00;H01L23/48;H01L29/46;H01L23/52 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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