| 摘要 |
A process of coating substrates with metal by immersing them into solutions of inorganic compounds in non-aqueous organic liquids. The solution preferably contains two components-a polar organic liquid such as an alcohol, polyol or ketone containing a metal salt in solution. The substrate may be a metal such as steel or aluminum, or a dielectric such as plastic or ceramic, which has been activated by the deposition of colloidal metallic particulates to form a seed metallic layer. The preferred embodiment involves immersion of a metal substrate at room temperature into a simple alcohol such as methanol, containing a salt such as copper chloride. Metal deposits onto the substrate at rates many times greater than aqueous electroless processes. The substrate may be immersed into active solution in a bath, or a paste of the organic and the salt may be formed and painted onto the substrate. In either case, spontaneous deposition occurs on the metal or pre-activated dielectric substrate. Powdered metal may be added to the bath or paint, and the particulates are co-deposited onto the substrate along with freshly formed metal. The salt may be formulated in-situ by digestion of the metal or reduction of a metal compound such as an oxide.
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