| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having a small dielectric constant, excellent in pattern accuracy and adhesiveness to a substrate, capable of developing with water or a diluted alkaline solution, and suitable for forming a printed circuit board, a solder resist for IC package or a interlayer dielectric layer or the like, and a photosensitive film using the resin composition. SOLUTION: The photosensitive resin composition and the photosensitive film feature comprising an unsaturated group-containing resin (A) obtained by reacting an epoxy (meth)acrylate which is a reaction product among a copolymer (a) consisting of a monomer having a fluorine atom and an ethylenic unsaturated double bond and a monomer having an epoxy group and an ethylenic unsaturated double bond, a compound (b) having an unsaturated double bond and a carboxyl group individually in one molecule and a saturated monocarboxylic acid (c) as an optional component, if necessary, with a polybasic acid anhydride (d), a diluent (B) and a photo-polymerization initiator (C). |
