Semiconductor device and method for manufacturing the same

摘要

A semiconductor device which is mounted with a plurality of semiconductor chips. The fraction defective is low when the device is manufactured, and the efficiency of inspection is high. A method for manufacturing such a semiconductor device is also disclosed. A plurality of kinds of semiconductor chips 1 are COB-mounted on a substrate 2 and the surface of the substrate 2 mounted with the chips 1 is encapsulated with a resin 3. Then all the chips 1 mounted on the substrate 2 are inspected at once. Semiconductor devices 10 are produced by cutting the substrate 2 into pairs of adjacently arranged two different kinds of semiconductor chips 1 together which are judged to be nondefective chips.