| 摘要 |
PROBLEM TO BE SOLVED: To stably and accurately polish a semiconductor wafer at a desired thickness and to stabilize a polishing rate. SOLUTION: In this polishing method, a polished member is polished by rotating a polishing surface plate 1 with an abrasive stuck and by pressing a wafer carrier 5 holding the polished member against the polishing surface plate while rotating it. In this case, the retraction quantity of the tip part of the wafer carrier 5 from the polished member surface is controlled based on the polishing pressure to the polishing surface plate 1 of the polished member or the measurement value of the retraction quantity. |
