METHOD FOR POLISHING WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method for polishing a wafer, capable of optimizing the effect of a retainer ring and preventing sagging of the peripheral part of the wafer. SOLUTION: In the method for polishing the wafer 4, slurry is dripped on a surface plate 3 fitted with a polishing cloth 2 and a plate 6 holding the wafer 4 is pressed and rotated in order to polish the surface of the wafer 4. The retainer ring 5 is mounted on the plate 6 in a manner such as to form clearance C in the peripheral part of the wafer 4 for the purpose of polishing the wafer 4 with the clearance C adjusted automatically.