发明名称 Package for multiple high power electrical components
摘要 A semiconductor package includes a plurality of semiconductor devices disposed in an array surrounding a central electrode structure carried by a package support member. The package is capable of withstanding high voltages and currents and includes a heat exchanger integral therewith.
申请公布号 US6291878(B1) 申请公布日期 2001.09.18
申请号 US19930052015 申请日期 1993.04.22
申请人 SUNDSTRAND CORPORATION 发明人 ANDERSON W. KYLE;PERSHALL ARTHUR A.;JACKSON STEPHEN E.
分类号 H01L23/051;H01L23/055;(IPC1-7):H01L23/48 主分类号 H01L23/051
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