发明名称 |
Package for multiple high power electrical components |
摘要 |
A semiconductor package includes a plurality of semiconductor devices disposed in an array surrounding a central electrode structure carried by a package support member. The package is capable of withstanding high voltages and currents and includes a heat exchanger integral therewith.
|
申请公布号 |
US6291878(B1) |
申请公布日期 |
2001.09.18 |
申请号 |
US19930052015 |
申请日期 |
1993.04.22 |
申请人 |
SUNDSTRAND CORPORATION |
发明人 |
ANDERSON W. KYLE;PERSHALL ARTHUR A.;JACKSON STEPHEN E. |
分类号 |
H01L23/051;H01L23/055;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/051 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|