| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of efficiently cleaning a processing equipment with a small number of stages at a low cost without causing fluctuation in the capacity of the processing equipment and the quality of wafers after processing, and also to provide a processing equipment for which such cleaning as above can be performed. SOLUTION: In the state where a process chamber of the processing equipment is evacuated, cleaning gas containing TFAA(trifluoroacetic acid) as a cleaning agent is supplied into the process chamber. When a metal such as copper, which is used for forming wiring or electrode and deposited on the inner wall of the process chamber, is directly formed into complex on contact with the cleaning agent (TFAA) in the cleaning gas without forming oxides and metallic salts. Because this complex is sublimated by evacuation and discharged out of the chamber, cleaning can be performed with a small number of stages at a low cost.
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