发明名称 Solderless circuit interconnect having a spring contact passing through an aperture
摘要 A spring acts as a central conductor of a fifty ohm RF coax connector, while an aluminum backing of a microstrip module has a hole coaxially surrounding the spring. The resulting annular hole in the aluminum backing represents the outer coax conductor and the initial portion of a stripline circuit board. The machining of the aluminum backing creates a continuous ground path through the transition, thereby reducing the effects of radiation loss, and the need is fulfilled for a low loss, broadband RF solderless interconnect for solid-state systems requiring the quick removal and replacement of microstrip or stripline circuits.
申请公布号 US6292073(B1) 申请公布日期 2001.09.18
申请号 US19980184462 申请日期 1998.10.26
申请人 THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE 发明人 EGOLF STEPHEN P.
分类号 H01P1/04;H05K1/02;H05K3/32;(IPC1-7):H01P1/04 主分类号 H01P1/04
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