| 摘要 |
Bonding pads (3) are arranged on the outer side of an in-chip circuit region (2) of a semiconductor integrated circuit board (1), and a scribed line (4) for chip separation is formed on the outer side thereof. A corner portion (4a) of the scribed line (4) is formed to be wider than a remaining portion (4b) thereof, and a wafer test circuit (5) and test pads (6) are formed in the corner portion (4a).
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