Stackable ball grid array semiconductor package and fabrication method thereof

摘要

A stackable Ball Grid Array (BGA) semiconductor chip package and a fabrication method thereof increases reliability and mount density of a semiconductor package. The stackable BGA semiconductor chip package includes a supporting member that includes a supporting plate and a supporting frame formed on edges of the supporting plate. Conductive patterns are formed in and extend through the supporting member. First metal traces are formed on a bottom of the supporting plate and the first metal traces are connected to first ends of the conductive patterns in the supporting member. Second metal traces are attached to an upper surface of a semiconductor chip, and the semiconductor chip is attached to the supporting member. The second metal traces are connected to bond pads of the chip, and to upper ends of the conductive patterns in the supporting member. A plurality of conductive balls are then attached to exposed portions of the first and/or the second metal traces.