发明名称 ANISOMETRIC CONDUCTIVE ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting anisotropic conductive adhesive which can adhere at a low temperature for a short period of time in an electric adhesion between fine circuits such as bonding between LCD and TCP, TCP and PCB and the like, and is excellent in adhesiveness, bonding reliability, storage stability, and reparability. SOLUTION: The anisotropic conductive adhesive comprises (A) a radical- polymerizable resin, (B) an organic peroxide, (C) a polyvinylbutylal resin as a thermoplastic elastomer, (D) a phosphate ester, (E) an epoxy silane coupling agent and (F) a conductive particle dispersed in these resin composition.
申请公布号 JP2001254058(A) 申请公布日期 2001.09.18
申请号 JP20000017655 申请日期 2000.01.26
申请人 SUMITOMO BAKELITE CO LTD 发明人 MIYAMOTO TETSUYA;KAWADA MASAKAZU
分类号 C09J7/02;C08F290/00;C09J4/06;C09J9/02;(IPC1-7):C09J4/06 主分类号 C09J7/02
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