发明名称 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
摘要 |
A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
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申请公布号 |
US6291556(B1) |
申请公布日期 |
2001.09.18 |
申请号 |
US20000534386 |
申请日期 |
2000.03.24 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
OSADA SHOICHI;ASANO EIICHI;INO SHIGEKI;AOKI TAKAYUKI;TOMIYOSHI KAZUTOSHI;SHIOBARA TOSHIO |
分类号 |
C08L83/07;C08K3/22;C08K9/08;C08L63/00;H01L23/29;(IPC1-7):C08K63/00 |
主分类号 |
C08L83/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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