发明名称 Method for forming pullback opening above shallow trenc isolation structure
摘要 A method for forming a pullback opening above a shallow trench isolation structure. A patterned mask layer is formed over a substrate. A sacrificial layer is formed on the sidewalls of the mask layer. The exposed portion of the substrate is etched to form a trench in the substrate. The sacrificial layer is removed to increase the width of the opening above the trench.
申请公布号 US6291312(B1) 申请公布日期 2001.09.18
申请号 US19990395108 申请日期 1999.09.14
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO, LTD. 发明人 CHAN BOR-WEN;LIU YUAN-HUNG
分类号 H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/762
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