| 摘要 |
PROBLEM TO BE SOLVED: To prevent that the compression of a molding material charged in the part corresponding to a thin-walled part is prohibited at the time of injection compression molding of a product having a thin walled part like an IC card. SOLUTION: A movable core 51 forming the thin-walled part of an IC card is incorporated in a movable mold 13. This movable core 51 is energized toward a fixed mold 11 by a spring 56 and, in such a state that the movable core 51 collides with the fixed mold 11, a cavity 13 is filled with a resin. Thereafter, the vol. of the cavity 13 is reduced to compress the resin in the cavity 13. The movable core 51 is moved by an increase in the pressure of the resin accompanied by this compression to be separated from the fixed mold 11. In this stage, the part corresponding to the thin-walled part is filled with a resin for the first time and the resin of this part is compressed in a soft state. |
