发明名称 Compound of metal foils comprising a soldering material
摘要 Metal foils are soldered using a soldering material. The metal foils are disposed in layers and/or are wound in layers to form a honeycomb body. An aluminum content of the foils amounts to at least 6 wt. %. The material is based upon nickel and contains 17 to 23 wt. % chromium, 5 to 10 wt. % silicon, 18 to 20 wt. % iron, and less than 0.5 wt. % boron.
申请公布号 AU4068701(A) 申请公布日期 2001.09.17
申请号 AU20010040687 申请日期 2001.03.08
申请人 EMITEC GESELLSCHAFT FUR EMISSIONSTECHNOLOGIE MBH 发明人 ANDREE BERGMANN
分类号 F01N3/10;B01D53/86;B01J35/04;B23K1/00;B23K35/30;B23K101/02;C22C19/05;F01N3/28 主分类号 F01N3/10
代理机构 代理人
主权项
地址