| 摘要 |
PURPOSE: A laser diode package integrated with a sub-mount and a photo-diode and a manufacturing method thereof are provided to shorten the manufacturing process of a laser diode and reduce defects thereof by integrating a sub-mount and a photo-diode into one chip. CONSTITUTION: An integrated laser diode package is composed of; a sub-mount for fixing a laser diode(16) and a PIN(p-i-n) photo-diode for monitoring a light irradiated from the laser diode(16) are integrated as one chip. Thus, a simple sub-mount and a photo-diode(30) are formed. The light is generated from a junction of the laser diode(16) and is directed to a disk through a lens. The photo-diode(30) converts the light from the laser diode(16) into corresponding electrical current and continuously monitors the output of the light in order to regularly maintain it.
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