| 摘要 |
PROBLEM TO BE SOLVED: To provide an ECR sputter film forming apparatus which can form a film of a uniform thickness on a plate. SOLUTION: The film is formed by oscillating an ECR sputter source S having a target, a coil and a plasma chamber so that the central axis 7a of the target follows a circumference L having a predetermined radius from a center of an HD substrate 1. As a result, the film thickness on a circumferential portion of the substrate 1 can be substantially same as that on a center portion, and the film thickness distribution can be uniform.
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