| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method, a circuit board, and electronic equipment that can cope with the electric connection with a narrow pitch. SOLUTION: The manufacturing method of a semiconductor device includes a process where a substrate 20 where a through hole 24 that is positioned on an electrode 12 is formed and at the same time wiring 22 is formed on a surface at the opposite side of the electrode 12 is arranged on a surface where the electrode 12 of a semiconductor chip 10 is formed, the through hole 24 is filled with a conductive material 30, and the electrode 12 is electrically connected to the wiring 22.</p> |
