METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To recognize defective marks on semiconductor chips at the same time and to securely apply die bonding to nondefective semiconductor chips for a short time. SOLUTION: A semiconductor wafer W transferred from a cassette lifter 2 is positioned and fixed by a wafer correction chute, and then a wafer picture recognition camera 4 picks up the entire picture of the semiconductor wafer W. A wafer map is produced from the fetched picture data, and a map coordinate in which a defective semiconductor chip is located is recognized. When picking up, only the position of a nondefective semiconductor chip is recognized by the camera 12 for recognizing chips according to the map coordinate and it is picked up thereafter.