摘要 |
PROBLEM TO BE SOLVED: To provide a cover structure which can be miniaturized and has a good soldering workability and a fixed mounted position of the cover. SOLUTION: The cover structure of an electronic unit has triangular protrusions 4d projecting from the ends 4c of the side walls 4b of a cover 4 on the side walls 4b, the tips of the protrusions 4d contact one surface 1a of a circuit board 1 to form a gap between the circuit board 1 and the ends 4c of the side walls 4b, resulting in very small contact parts of the tips. Hence, compared with the prior art, the gap between a side electrode 3 and adjacent side electrode 2 can be very small and thus a cover structure can be provided, allowing the circuit board 1 to be miniaturized.
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