发明名称 HEAT ACCUMULATING MICROCAPSULE
摘要 PROBLEM TO BE SOLVED: To prepare a heat accumulating microcapsule which has an excellent processibility compared to that of the conventional heat accumulating microcapsules and may be used for general purposes. SOLUTION: This heat accumulating microcapsule is prepared by forming at least one layer of a capsule wall essentially comprising a thermoplastic resin obtained through radical polymerization around a core material essentially comprising a compound allowing free phase transition. Here, the average particle size of the microcapsule is from 10 to 3,000 μm.
申请公布号 JP2001247855(A) 申请公布日期 2001.09.14
申请号 JP20000060743 申请日期 2000.03.06
申请人 SEKISUI CHEM CO LTD 发明人 MATSUMURA KENICHI;FUJII NORIKI;OMURA TAKAHIRO
分类号 F24H7/00;B01J13/14;C08F2/44;C09K5/06;C09K5/08;F28D20/00 主分类号 F24H7/00
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