发明名称 |
HEAT ACCUMULATING MICROCAPSULE |
摘要 |
PROBLEM TO BE SOLVED: To prepare a heat accumulating microcapsule which has an excellent processibility compared to that of the conventional heat accumulating microcapsules and may be used for general purposes. SOLUTION: This heat accumulating microcapsule is prepared by forming at least one layer of a capsule wall essentially comprising a thermoplastic resin obtained through radical polymerization around a core material essentially comprising a compound allowing free phase transition. Here, the average particle size of the microcapsule is from 10 to 3,000 μm. |
申请公布号 |
JP2001247855(A) |
申请公布日期 |
2001.09.14 |
申请号 |
JP20000060743 |
申请日期 |
2000.03.06 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
MATSUMURA KENICHI;FUJII NORIKI;OMURA TAKAHIRO |
分类号 |
F24H7/00;B01J13/14;C08F2/44;C09K5/06;C09K5/08;F28D20/00 |
主分类号 |
F24H7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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