STRESS REDUCING INTERPOSER FOR ELECTRIC COMPONENT MOUNTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an interposer for connecting electric components having different thermal expansion coefficients with a stress difference reduced. SOLUTION: The interposer electrically connects two electric components having different thermal expansion coefficients. The interposer includes two substrates having different thermal expansion coefficients, and the substrates have first and second surfaces, respectively. The interposer has electrical connectors provided on the first surfaces of the two substrates, and the connectors electrically connect two corresponding electrical components. A flexible circuit layer is provided between the two substrates to couple the connector on the first substrate with the connector on the second substrate. The two substrates are mounted as bent so that the second faces of the both substrates are opposed to each other.