| 摘要 |
PROBLEM TO BE SOLVED: To provide probe structure that has a bump contact having strong adhesion of projections with improved strength in projection, less deterioration against repetition of contact, and no variation in contact resistance for each bump contact, and manufactured easily, and its manufacturing method, or the like. SOLUTION: In the probe structure, a bump contact 2 provided on one surface of an insulating substrate 1, and an electrode 3 for composing one portion of a conductive circuit provided on and/or in the other surface of the insulating substrate 1. An uneven layer (a surface layer 2e with surface roughness) formed by assembling small grains is formed on the surface of at least the bump contact 2.
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