发明名称 OFFSET MEASUREMENT METHOD, TOOL POSITION DETECTION METHOD AND BONDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To exactly execute the measurement of tool position in offset correction. SOLUTION: The axis center 4a of a tool 4 is made access to a reference member 30, a reference pattern L is cast on the tool 4 by turning on a laser diode 15 and the shift quantity of the reference member 30 and the tool 4 in X-direction is measured based on the image of the reference pattern L projected on the tool 4. The image of the tool 4 in Y-direction (direction facing to the paper surface) is photographed with a position detection camera 7 and the shift quantity of the reference member 30 and the tool 4 in Y-direction is measured. By moving the position detection camera 7 to make access to the reference member 30, the shift quantity between the light axis 7a of the position detection camera 7 and the reference member is measured with the position detection cemera 7. Based on the measured values and the moving values, exact offset quantity is obtained.</p>
申请公布号 JP2001249007(A) 申请公布日期 2001.09.14
申请号 JP20000059843 申请日期 2000.03.06
申请人 SHINKAWA LTD 发明人 HAYATA SHIGERU;KYOMASU RYUICHI;ENOKIDO SATOSHI;SASANO TOSHIAKI
分类号 G01B11/00;B23K20/00;G01B11/03;H01L21/60;(IPC1-7):G01B11/00 主分类号 G01B11/00
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