发明名称 |
SEMICONDUCTOR DEVICE AND PROCESS FOR FORMING CONDUCTIVE STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor device and a conductive structure having high reliability and performance. SOLUTION: The semiconductor device and the conductive structure are formed while having a metal layer. In one embodiment, the semiconductor device comprises an amorphous metal layer 22 and a crystal metal layer 42. The amorphous metal layer 22 reduces the possibility that contaminants permeate through the amorphous metal layer 22. In order to keep relatively low resistivity, a more conducive crystal metal layer 42 may be formed on the amorphous metal layer 22. When the conductive structure is formed, a precursor substance containing a metal and a scavenger gas flow simultaneously at least momentarily. The conductive structure may be a part of the gate electrode.
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申请公布号 |
JP2001250794(A) |
申请公布日期 |
2001.09.14 |
申请号 |
JP20010007746 |
申请日期 |
2001.01.16 |
申请人 |
MOTOROLA INC |
发明人 |
TOBIN PHILIP J;ADTUTO ORUBUMI;BAIKAS MAITI |
分类号 |
C23C16/18;H01L21/28;H01L21/285;H01L21/3205;H01L23/52;H01L29/49;H01L29/78;H01L29/786;(IPC1-7):H01L21/285;H01L21/320 |
主分类号 |
C23C16/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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