发明名称 SEMICONDUCTOR DEVICE AND PROCESS FOR FORMING CONDUCTIVE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To realize a semiconductor device and a conductive structure having high reliability and performance. SOLUTION: The semiconductor device and the conductive structure are formed while having a metal layer. In one embodiment, the semiconductor device comprises an amorphous metal layer 22 and a crystal metal layer 42. The amorphous metal layer 22 reduces the possibility that contaminants permeate through the amorphous metal layer 22. In order to keep relatively low resistivity, a more conducive crystal metal layer 42 may be formed on the amorphous metal layer 22. When the conductive structure is formed, a precursor substance containing a metal and a scavenger gas flow simultaneously at least momentarily. The conductive structure may be a part of the gate electrode.
申请公布号 JP2001250794(A) 申请公布日期 2001.09.14
申请号 JP20010007746 申请日期 2001.01.16
申请人 MOTOROLA INC 发明人 TOBIN PHILIP J;ADTUTO ORUBUMI;BAIKAS MAITI
分类号 C23C16/18;H01L21/28;H01L21/285;H01L21/3205;H01L23/52;H01L29/49;H01L29/78;H01L29/786;(IPC1-7):H01L21/285;H01L21/320 主分类号 C23C16/18
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