ETCHANT, ETCHING METHOD, AND SEMICONDUCTOR SILICON WAFER

摘要

PROBLEM TO BE SOLVED: To provide an etchant and an etching method which help prevent metal contamination of a semiconductor silicon wafer and a semiconductor silicon wafer which is least contaminated with metal. SOLUTION: This etchant is prepared by dipping a stainless steel into an alkaline water solution for ten or more hours, and a semiconductor silicon wafer undergoes etching by using this etchant in this etching method. By this setup, a semiconductor silicon wafer which is least contaminated by metal can be obtained.