| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high-temperature electrostatic chuck. SOLUTION: This electrostatic chuck has an expansion joint between a chuck and a heat transfer body. The expansion joint provides a hermetic seal, absorbs the difference in thermal expansion between the chuck and heat transfer body, and/or controls the quantity of heat conducted from the chuck to the heat transfer body. A plenum provided between surface of the chuck and the surface of the heat transfer body separated from the surface of the chuck is filled with a heat transfer gas which is made to pass through a gas passage, such as the lift pin hole of the chuck for cooling the back face of a substrate supported on the chuck. The heat transfer gas in the plenum conducts heat from the chuck to the heat transfer body. Since this chuck can operate at a temperature of >200 deg.C, the chuck can be used for plasma etching of a noble metal, such as Pt, etc., which is required to be etched at a high temperature for evaporating a low-volatility etched product.</p> |
