发明名称 MULTILAYER PRINTED WIRING BOARD AND INSPECTION METHOD OF MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To accurately and quickly inspect deviation of a wiring pattern. SOLUTION: This inspection method is provided with a step wherein probes 31, 32 are brought into contact with land parts 23a, 23b of both end portions of a first outer layer inspecting pattern 23, respectively, to inspect whether an electric continuity between the land parts 23a, 23b of the first outer layer inspecting pattern 23 exists, and probes 33, 34 are brought into contact with land parts 24a, 24b of both end portions of a second outer layer inspecting pattern 24, respectively, to inspect whether an electric continuity between the land parts 24a, 24b of the second outer layer inspecting pattern 23 exists, and a step wherein the probes 33, 34 are brought into contact with the land part 23b of the first outer layer inspecting pattern 23 and the land part 24b of the second outer layer inspecting pattern 24, respectively, to inspect whether an electric continuity between the first outer layer inspecting pattern 23 and the second outer layer inspecting pattern 24 exists.
申请公布号 JP2001251062(A) 申请公布日期 2001.09.14
申请号 JP20000063385 申请日期 2000.03.03
申请人 SONY CORP 发明人 KUHARA KENJI;ISHIKAWA TAKASHI;HORIE SHOJI
分类号 G01R31/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 G01R31/02
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