| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where a wiring pattern is shorter. SOLUTION: On a side facing an ROM 2 of an ASIC 1, external connection terminals are provided according to pin arrangement of the ROM 2. To be specific, address terminals A18, A19, A17, A8, A7, A9, A6, A10, etc., are sequentially provided according to pin arrangement of address terminal of the ROM 2, while, below them, data terminals D15, D0, D7, D8, D14, etc., are sequentially provided according to pin arrangement of data terminal of the ROM 2. Since the pin arrangement of external connection terminal of the ASIC 1 is decided according to the pin arrangement of the ROM 2, the wiring pattern connecting the ASIC 1 to the ROM 2 can be shorter. Further, a plurality of wiring patterns do not cross each other for easy pattern design not influenced by noise such crosstalk.
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