| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate with a built-in capacitor, where a high dielectric layer consisting of perovskite structural oxide or the like is used and an Fe-base conductive member is used as a base substrate, at a low cost. SOLUTION: A first conductive layer formed of a high melting point metal such as Cr, a second conductor layer with a layer formed of conductive oxide or noble metal, a dielectric layer and a third electrode layer are laminated one by one on a base substrate consisting of an Fe-base conductive member, and a capacitor is formed. After a capacitor is formed, a base substrate is processed and a via electrically connecting front and rear surfaces is formed, thus obtaining a circuit substrate which is proper for an interposer. A capacitor is used as a decoupling capacitor by connecting a first electrode formed of a base substrate to a ground terminal and a counter electrode to a power supply terminal.
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