| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal base wiring board by which portions of a metal base wiring board, which are to be plated, are plated with noble metal in a uniform thickness by electric plating without using an external lead wire. SOLUTION: Electric power is supplied to a circuit pattern 11 through leads 10a, 10b from a base metal 1 to plate portions 5, 7, 8, 12, which are to be plated, with noble metal.
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