| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of soldering a printed board without detriment to production and defective soldering when soldering is carried out by the use of RMA type flux or lead-free solder in a flexible manufacturing system in which various types of printed boards for a large amount of solder, a narrow pitch, or a normal design are mixedly manufactured, and an automatic soldering apparatus therefor. SOLUTION: A solder tank is provided with a member for surrounding the whole of a rear former and the top plate of the member can be moved. When the slanting angle of the rear former is changed according to the respective printed boards, the top plate of the member is moved to prevent the rear former from hitting the top plate.
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