| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a semiconductor by prolonging the period between maintenances of a gas trapping device, by making the device to hardly get clogged by increasing the capacity of the device and making the manufacturing of the semiconductor easier by reducing the manufacturing man-hours of the semiconductor. SOLUTION: A semiconductor manufacturing device treats a substrate by supplying a reaction gas to a reaction chamber, and separates and removes a resulted by-product of reaction from an exhaust gas by means of the gas trap device 26 installed in an exhaust pipe. The device 26 is constituted in such a way that a jacket 15 is formed of an inner pipe 27 having a larger diameter than the exhaust pipe, and an outer pipe 38 which is laid concentrically with the inner pipe 27 between the pipes 27 and 38 and a spiral tube 28 is laid in the inner pipe 27. Then a cooling medium introducing barrel 30 connecting to the outer pipe 38 is attached to the inner pipe 27, and a cooling medium discharging barrel 20 which is opened in the jacket 15 is attached to the inner pipe 27. In addition, both ends of the spiral tube 28 are respectively connected to the barrels 30 and 20, and medium supply and discharge tubes 23 and 24 are connected to the outer pipe 38 and made to communicate with the barrel 30 and jacket 15, respectively.
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