SILICON WAFER MANUFACTURING SYSTEM AND METHOD

摘要

A method and system for manufacturing a silicon wafer (22) is disclosed. Ingot indicia includes the manufacturer's data as well asthe ingot's specific information, and also identifies the criystallographic orientation of the ingot. A plurality of wafers are sliced from the ingot with a portion of the ingot indicia on each wafer (22). Wafer indicia is then marked onto a peripheral edge (24) of the wafer by laser (26) controlled by CPU (20). The wafer indicia includes a mark to identify the crystallographic orientation of the wafer as well as specific information about the ingot and the wafer. The wafer indicia may include dopant levels as well as resistivity and conductivity levels of the wafer.