发明名称 Method for the formation and lift-off of porous silicon layer
摘要 A method for the manufacture, formation, and removal of porous layers in a semiconductor substrate having at least a surface acting as a cathode. The method comprises applying a solution comprising negative Fluorine (F<->) ions between the surface of the semiconductor substrate and an anode. The method further comprises applying a predetermined current between the anode and the cathode. The method further comprises maintaining the predetermined current at substantially the same current value for a sufficient amount of time to obtain a low porosity layer at said surface. A high porosity layer positioned under the low porosity layer is also obtained by the method of the invention.
申请公布号 AU2643101(A) 申请公布日期 2001.09.13
申请号 AU20010026431 申请日期 2001.03.08
申请人 INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM(IMEC) 发明人 CHETAN SINGH SOLANKY;RENAT BILYALOV;JEF POORTMANS;GUY BEAUCARNE
分类号 H01L21/306;H01L21/3063;H01L21/762 主分类号 H01L21/306
代理机构 代理人
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