发明名称 |
Method for the formation and lift-off of porous silicon layer |
摘要 |
A method for the manufacture, formation, and removal of porous layers in a semiconductor substrate having at least a surface acting as a cathode. The method comprises applying a solution comprising negative Fluorine (F<->) ions between the surface of the semiconductor substrate and an anode. The method further comprises applying a predetermined current between the anode and the cathode. The method further comprises maintaining the predetermined current at substantially the same current value for a sufficient amount of time to obtain a low porosity layer at said surface. A high porosity layer positioned under the low porosity layer is also obtained by the method of the invention. |
申请公布号 |
AU2643101(A) |
申请公布日期 |
2001.09.13 |
申请号 |
AU20010026431 |
申请日期 |
2001.03.08 |
申请人 |
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM(IMEC) |
发明人 |
CHETAN SINGH SOLANKY;RENAT BILYALOV;JEF POORTMANS;GUY BEAUCARNE |
分类号 |
H01L21/306;H01L21/3063;H01L21/762 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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