| 摘要 |
A thermosetting adhesive material for connecting connection terminals provided on the opposing sides of a pair of opposing substrates, contains a thermosetting resin and an insulating inorganic filler, wherein the insulating inorganic filler content (a; vol %) and the elastic modulus of the thermosetting adhesive material after curing (E; GPa/30° C.) satisfy the following relational formula (1): <paragraph lvl="0"><in-line-formula>0.042a+0.9<E<0.106a+2.5 (1) </in-line-formula>and at the same time, the insulating inorganic filler content (a; vol %) and the tensile elongation (d; %) at 25° C. of the thermosetting adhesive material after curing satisfy the following relational formula (2). <paragraph lvl="0"><in-line-formula>-0.072a+4<d<-0.263a+13 (2) </in-line-formula>
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