发明名称 |
Electronic part mounting method |
摘要 |
At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.
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申请公布号 |
US2001020635(A1) |
申请公布日期 |
2001.09.13 |
申请号 |
US20010801855 |
申请日期 |
2001.03.09 |
申请人 |
MAEDA YUKIHIRO;OOTANI YUJI;NAKANO TETSUO;NAGASAKA TAKASHI |
发明人 |
MAEDA YUKIHIRO;OOTANI YUJI;NAKANO TETSUO;NAGASAKA TAKASHI |
分类号 |
H05K3/24;B23K20/00;H01L21/50;H01L21/60;H05K3/12;H05K3/40;(IPC1-7):B23K31/02;B21D39/00;B23K1/20 |
主分类号 |
H05K3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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