| 摘要 |
A circuit module has a circuit arrangement (2), a cooling device (6) designed to remove the heat supplied to the cooling device (6) to the ambience, and a heat-transfer device (4) designed to transfer heat generated by the circuit module (2) to the cooling device (6). The heat transfer device (4) is provided with a fluid, especially a liquid, gel, paste or similar material, and/or a gas and/or a mixture thereof. The circuit arrangement (2) has at least one semiconductor chip (8) and/or at least one further electronic module, specifically arranged on a common basic substrate (10). |
